內容簡介
"In the 21 century, wireless communication incorporating enormous computing power, mobile internet access capability, and multimedia processing become the emerging technologies. These technologies drive the main stream of 3C, i.e. computing, communication and consumer applications products such as smart phone, portable consumer entertainments, e-home devices, etc. With the rapid advance of IC process, system-on-chip (SoC) will be the key component in these 3C electronic products. A generic SoC for wireless communication is usually composed of the RF front-end IC, analog mixed-signal IC, digital subsystem IC parts and memory subsystem. The major design goals include low-voltage, low-power consumption, high-quality signal processing, high-performance computing and cost effectiveness. "
作者簡介
目次
相關附件
下載 試閱檔 / 考題與解答下載教學投影片
同書系